MCP2510
TABLE 12-1: DC CHARACTERISTICS
DC Characteristics
Industrial (I): TAMB = -40°C to +85°C VDD = 3.0V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param.
No.
Sym
Characteristic
Min
Max
Units
Conditions
VDD Supply Voltage
3.0
5.5
V
VRET Register Retention Voltage
2.4
—
V
High Level Input Voltage
Note
VIH
RXCAN
2
VDD+1
V
SCK, CS, SI, TXnRTS Pins
.7 VDD
VDD+1
V
OSC1
.85 VDD
VDD
V
RESET
.85 VDD
VDD
V
Low Level Input Voltage
Note
VIL
RXCAN,TXnRTS Pins
-0.3
.15 VDD
V
SCK, CS, SI
-0.3
0.4
V
OSC1
VSS
.3 VDD
V
RESET
VSS
.15 VDD
V
Low Level Output Voltage
VOL TXCAN
—
0.6
V IOL = -6.0 mA, VDD = 4.5V
RXnBF Pins
—
0.6
V IOL = -8.5 mA, VDD = 4.5V
SO, CLKOUT
—
0.6
V IOL = -2.1 mA, VDD = 4.5V
INT
—
0.6
V IOL = -1.6 mA, VDD = 4.5V
High Level Output Voltage
V
VOH TXCAN, RXnBF Pins
VDD -0.7
—
V IOH = 3.0 mA, VDD = 4.5V, I temp
SO, CLKOUT
VDD -0.5
—
V IOH = 400 µA, VDD = 4.5V
INT
VDD -0.7
—
V IOH = 1.0 mA, VDD = 4.5V
Input Leakage Current
ILI
All I/O except OSC1 and
TXnRTS pins
-1
+1
µA CS = RESET = VDD,
VIN = VSS to VDD
OSC1 Pin
-5
+5
µA
CINT
Internal Capacitance
(All Inputs And Outputs)
—
7
pF TAMB = 25°C, fC = 1.0 MHz,
VDD = 5.0V (Note)
IDD Operating Current
—
10
mA VDD = 5.5V, FOSC = 25 MHz,
FCLK = 1 MHz, SO = Open
IDDS Standby Current (Sleep Mode)
—
5
µA CS, TXnRTS = VDD, Inputs tied to
VDD or VSS
Note: This parameter is periodically sampled and not 100% tested.
DS21291F-page 62
© 2007 Microchip Technology Inc.