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MCP2510T-E/SO View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
MCP2510T-E/SO
Microchip
Microchip Technology 
MCP2510T-E/SO Datasheet PDF : 80 Pages
First Prev 61 62 63 64 65 66 67 68 69 70 Next Last
13.0 PACKAGING INFORMATION
13.1 Package Marking Information
18-Lead PDIP (300 mil)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC (300 mil)
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
20-Lead TSSOP (4.4 mm)
XXXXXXXX
XXXXXNNN
YYWW
MCP2510
Example:
MCP2510-I/P e3
XXXXXXXXXXXXXXXXX
0726NNN
Example:
MCP2510-I/SO e3
XXXXXXXXXXXX
XXXXXXXXXXXX
0737NNN
Example:
MCP2510 e3
I/STNNN
0728
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS21291F-page 65

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