MCP2510T-E/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP2510T-E/SO Datasheet PDF : 80 Pages
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MCP2510
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1 23
D
E
A
A2
A1
b1
L
c
b
e
eB
Units
INCHES
Dimension Limits MIN
NOM
MAX
Number of Pins
N
18
Pitch
e
.100 BSC
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.300
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.880
.900
.920
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.014
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
–
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-007B
DS21291F-page 66
© 2007 Microchip Technology Inc.
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