ADP7105ARDZ-5.0(Rev0) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADP7105ARDZ-5.0 Datasheet PDF : 28 Pages
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Data Sheet
In the case where the board temperature is known, use the ΨJB
thermal characterization parameter to estimate the junction
temperature rise (see Figure 77 and Figure 78). Maximum
junction temperature (TJ) is calculated from the board tempera-
ture (TB) and power dissipation (PD) using the following
formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package
and 31.3°C/W for the 8-lead SOIC package (see Table 7).
140
120
100
80
60
40
TB = 25°C
20
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TOTAL POWER DISSIPATION (W)
Figure 77. LFCSP
ADP7105
140
120
100
80
60
40
20
0
0
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TOTAL POWER DISSIPATION (W)
Figure 78. SOIC
Rev. 0 | Page 23 of 28
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