ADP7105
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP7105.
However, as shown in Table 6, a point of diminishing returns
is eventually reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0805 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where space is limited.
Data Sheet
Figure 80. Example SOIC PCB Layout
Figure 79. Example LFCSP PCB Layout
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