Data Sheet
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
2.48
2.38
2.23
5
8
INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.80 MAX
0.55 NOM
0.30 0.50 BSC
0.25
0.18
0.50
0.40
0.30
EXPOSED
PAD
4
1
BOTTOM VIEW
1.74
1.64
1.49
0.20 MIN
PIN 1
INDICATOR
(R 0.2)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 81. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-5)
Dimensions shown in millimeters
5.00
4.90
3.098
4.80
0.356
8
5
6.20
4.00 6.00
3.90 5.80
3.80
0.457
1
4
1.27 BSC
1.75
1.35
TOP VIEW
3.81 REF
1.65
1.25
BOTTOM VIEW
0.50 45°
0.25
SEATING
PLANE
0.10 MAX
0.51
0.05 NOM
8°
1.04 REF
0.31
COPLANARITY 0°
0.10
2.41
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.25
0.17
1.27
0.40
COMPLIANT TO JEDEC STANDARDS MS-012-A A
Figure 82. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-2)
Dimensions shown in millimeters
ADP7105
Rev. 0 | Page 25 of 28