M45PE40
Table 6. Power-Up Timing and VWI Threshold
Symbol
Parameter
tVSL1 VCC(min) to S low
tPUW1 Time delay before the first Write, Program or Erase instruction
VWI1 Write Inhibit Voltage
Note: 1. These parameters are characterized only, over the temperature range –40°C to +85°C.
Min.
30
1
1.5
Max. Unit
µs
10
ms
2.5
V
INITIAL DELIVERY STATE
The device is delivered with the memory array
erased: all bits are set to 1 (each byte contains
FFh). All usable Status Register bits are 0.
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 7. may cause permanent damage to the de-
vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of
this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 7. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
TSTG
Storage Temperature
–65
150
°C
TLEAD
Lead Temperature during Soldering
See note 1
°C
VIO
Input and Output Voltage (with respect to Ground)
–0.6
4.0
V
VCC
Supply Voltage
–0.6
4.0
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
–2000
2000
V
Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
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