PIC16LC924-08/CL View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC924-08/CL

8-Bit CMOS Microcontroller with LCD Driver

Microchip Technology 

PIC16C9XX

17.1 DC Characteristics:

PIC16C923/924-04 (Commercial, Industrial)

PIC16C923/924-08 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and

0˚C ≤ TA ≤ +70˚C for commercial

Param

No.

Characteristic

Sym Min Typ† Max Units

Conditions

D001 Supply Voltage

D001A

VDD

4.0 - 6.0 V XT, RC and LP osc configuration

4.5 - 5.5 V HS osc configuration

D002* RAM Data Retention VDR

Voltage (Note 1)

- 1.5 - V

D003

VDD start voltage to

ensure internal

Power-on Reset signal

VPOR

- VSS - V See Power-on Reset section for details

D004* VDD rise rate to ensure SVDD

internal Power-on

Reset signal

0.05 -

- V/ms (Note 6) See Power-on Reset section for

details

D010 Supply Current (Note 2) IDD

D011

D012

- 2.7 5 mA XT and RC osc configuration

FOSC = 4 MHz, VDD = 5.5V (Note 4)

- 22.5 48 µA LP osc configuration,

FOSC = 32 kHz, VDD = 4.0V

- 3.5 7 mA HS osc configuration

FOSC = 8 MHz, VDD = 5.5V

D020 Power-down Current IPD

(Note 3)

- 1.5 21 µA VDD = 4.0V

Module Differential Cur-

rent (Note 5)

D021 Watchdog Timer

∆IWDT

- 6.0 20 µA VDD = 4.0V

D022* LCD Voltage Generation ∆ILCDRC -

w/internal RC osc

enabled

40 55 µA VDD = 4.0V (Note 7)

D024* LCD Voltage Generation ∆ILCDT1 -

w/Timer1 @ 32.768 kHz

33 60 µA VDD = 4.0V (Note 7)

D025* Timer1 oscillator

∆IT1OSC - 10.6 17 µA VDD = 4.0V

D026* A/D Converter

∆IAD

- 1.0 - µA A/D on, not converting

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

6: PWRT must be enabled for slow ramps.

7: ∆ΙLCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation cir-

cuitry. This does not include current dissipated by the LCD panel.

DS30444E - page 142

© 1997 Microchip Technology Inc.

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