ST7PSCR1E4M1/XXX View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST7PSCR1E4M1/XXX

8-BIT LOW-POWER, FULL-SPEED USB MCU WITH 16K FLASH, 768 RAM, SMARTCARD I/F, TIMER

STMicroelectronics 

ST7SCR

14 ELECTRICAL CHARACTERISTICS

14.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices for protecting the in-

puts against damage due to high static voltages,

however it is advisable to take normal precautions

to avoid appying any voltage higher than the spec-

ified maximum rated voltages.

For proper operation it is recommended that VI

and VO be higher than VSS and lower than VDD.

Reliability is enhanced if unused inputs are con-

nected to an appropriate logic voltage level (VDD

or VSS).

Power Considerations. The average chip-junc-

tion temperature, TJ, in Celsius can be obtained

from:

Where:

TJ = TA + PD x RthJA

TA = Ambient Temperature.

RthJA =Package thermal resistance

(junction-to ambient).

PD = PINT + PPORT.

PINT = IDD x VDD (chip internal power).

PPORT =Port power dissipation

determined by the user)

Stresses above those listed as “absolute maxi-

mum ratings” may cause permanent damage to

the device. This is a stress rating only and func-

tional operation of the device at these conditions is

not implied. Exposure to maximum rating for ex-

tended periods may affect device reliability.

Symbol

VDD - VSS

VIN

VOUT

ESD

ESDCard

IVDD_i

IVSS_i

Ratings

Supply voltage

Input voltage

Output voltage

ESD susceptibility

ESD susceptibility for card pads

Total current into VDD_i (source)

Total current out of VSS_i (sink)

Value

6.0

VSS - 0.3 to VDD + 0.3

VSS - 0.3 to VDD + 0.3

2000

4000

250

250

Unit

V

V

V

V

V

mA

General Warning: Direct connection to VDD or VSS of the I/O pins could damage the device in case of program counter

corruption (due to unwanted change of the I/O configuration). To guarantee safe conditions, this connection has to be

done through a typical 10KΩ pull-up or pull-down resistor.

Thermal Characteristics

Symbol

RthJA

TJmax

TSTG

PD

Ratings

Package thermal resistance

TQFP64

SO24

Max. junction temperature

Storage temperature range

Power dissipation (maximum value)

Value

60

80

150

-65 to +150

500

Unit

°C/W

°C

°C

mW

76/102

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