ST72521AR9TC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72521AR9TC

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C, CAN INTERFACE

STMicroelectronics 

ST72521M/R/AR

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

Ratings

Package thermal resistance (junction to ambient)

TQFP80 14x14

TQFP64 14x14

TQFP64 10x10

Value

55

47

50

Unit

°C/W

PD

TJmax

Power dissipation 1)

Maximum junction temperature 2)

500

mW

150

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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