ST72521AR9TC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72521AR9TC

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C, CAN INTERFACE

STMicroelectronics 

ST72521M/R/AR

13.3 SOLDERING AND GLUEABILITY INFORMATION

Recommended soldering information given only as design guidelines.

Figure 118. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)

250

200

150

Temp. [°C]

100

50

80°C

PREHEATING

PHASE

5 sec

SOLDERING

PHASE

COOLING PHASE

(ROOM TEMPERATURE)

0

Time [sec]

20

40

60

80

100

120

140

160

Figure 119. Recommended Reflow Soldering Oven Profile (MID JEDEC)

250

200

150

Temp. [°C]

100

50

90 sec at 125°C

ramp up

2°C/sec for 50sec

Tmax=235+/-5°C

for 25 sec

150 sec above 183°C

ramp down natural

2°C/sec max

0

100

200

300

Time [sec]

400

Recommended glue for SMD plastic packages dedicated to molding compound with silicone:

s Heraeus: PD945, PD955

s Loctite: 3615, 3298

190/199

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