PIC12F629-I View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC12F629-I Datasheet PDF : 132 Pages
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PIC12F629/675
14.2 Package Details
The following sections give the technical details of the
packages.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
E
A
α
A2
c
β
eB
A1
B1
B
L
p
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§ eB
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
* Controlling Parameter
§ Significant Characteristic
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
8
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
MIN
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
DS41190C-page 116
2003 Microchip Technology Inc.
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