PIC12F629-I View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC12F629-I Datasheet PDF : 132 Pages
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PIC12F629/675
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
E
B
E1
n
R
D1 D
p
L
D2
12
TOP VIEW
α
A1
EXPOSED
METAL
PADS
A2
A3
A
PIN 1
ID
E2
BOTTOM VIEW
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Base Thickness
A3
Overall Length
E
Molded Package Length
E1
Exposed Pad Length
E2
Overall Width
D
Molded Package Width
D1
Exposed Pad Width
D2
Lead Width
B
Lead Length
L
Tie Bar Width
R
Mold Draft Angle Top
α
MIN
.000
.152
.085
.014
.020
INCHES
NOM
8
.050 BSC
.033
.026
.0004
.008 REF.
.194 BSC
.184 BSC
.158
.236 BSC
.226 BSC
.091
.016
.024
.014
MAX
.039
.031
.002
.163
.097
.019
.030
12
MILLIMETERS*
MIN
NOM
8
1.27 BSC
0.85
0.65
0.00
0.01
0.20 REF.
4.92 BSC
4.67 BSC
3.85
4.00
5.99 BSC
5.74 BSC
2.16
2.31
0.35
0.40
0.50
0.60
.356
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
DS41190C-page 118
2003 Microchip Technology Inc.
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