PIC16LC773I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC773I/SO Datasheet PDF : 202 Pages
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17.0 PACKAGING INFORMATION
17.1 Package Marking Information
28-Lead PDIP (Skinny DIP)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
AABBCDE
28-Lead CERDIP Windowed
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXX
AABBCDE
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCAE
PIC16C77X
Example
PIC16C773-20/SP
1317HAT
Example
PIC16C774/JW
1305HAT
Example
PIC16C773-20/SO
1310SAA
Example
PIC16C773
20I/SS
9817SBP
Legend: MM...M
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
1999-2013 Microchip Technology Inc.
Advance Information
DS30275B-page 175
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