PIC16LC773I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.5 K04-073 28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
E
p
D
B
2
n
1
L
c
R2
A
A1
R1
A2
L1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
p
0.026
0.65
Number of Pins
n
28
28
Overall Pack. Height
A
0.068
0.073
0.078
1.73
1.86
1.99
Shoulder Height
A1
0.026
0.036
0.046
0.66
0.91
1.17
Standoff
A2
Molded Package Length D‡
Molded Package Width
E‡
0.002
0.396
0.205
0.005
0.402
0.208
0.008
0.407
0.212
0.05
10.07
5.20
0.13
10.20
5.29
0.21
10.33
5.38
Outside Dimension
E1
0.301
0.306
0.311
7.65
7.78
7.90
Shoulder Radius
R1
0.005
0.005
0.010
0.13
0.13
0.25
Gull Wing Radius
R2
0.005
0.005
0.010
0.13
0.13
0.25
Foot Length
Foot Angle
L
0.015
0.020
0.025
0.38
0.51
0.64
0
4
8
0
4
8
Radius Centerline
L1
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
Lower Lead Width
B†
0.005
0.007
0.009
0.13
0.18
0.22
0.010
0.012
0.015
0.25
0.32
0.38
Mold Draft Angle Top
0
5
10
0
5
10
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS30275B-page 180
Advance Information
1999-2013 Microchip Technology Inc.
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