PIC16LC773I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.3 K04-080 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
W2
D
2
n
1
W1
E1
A
R
c
eB
A2
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D
Package Width
E
Radius to Radius Width
E1
Overall Row Spacing
eB
Window Width
W1
Window Length
W2
* Controlling Parameter.
MIN
0.098
0.016
0.050
0.010
0.008
0.170
0.107
0.015
0.135
1.430
0.285
0.255
0.345
0.130
0.290
INCHES*
NOM
0.300
28
0.100
0.019
0.058
0.013
0.010
0.183
0.125
0.023
0.140
1.458
0.290
0.270
0.385
0.140
0.300
B1
B
MAX
0.102
0.021
0.065
0.015
0.012
0.195
0.143
0.030
0.145
1.485
0.295
0.285
0.425
0.150
0.310
A1
L
p
MILLIMETERS
MIN
NOM
7.62
28
2.49
2.54
0.41
0.47
1.27
1.46
0.25
0.32
0.20
0.25
4.32
4.64
2.72
3.18
0.00
0.57
3.43
3.56
36.32
37.02
7.24
7.37
6.48
6.86
8.76
9.78
0.13
0.14
0.29
0.3
MAX
2.59
0.53
1.65
0.38
0.30
4.95
3.63
0.76
3.68
37.72
7.49
7.24
10.80
0.15
0.31
DS30275B-page 178
Advance Information
1999-2013 Microchip Technology Inc.
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