PIC16C712T-04/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16C712T-04/SO

8-Bit CMOS Microcontrollers with A/D Converter and Capture/Compare/PWM

Microchip Technology 

PIC16C712/716

12.2 DC Characteristics: PIC16LC712/716-04 (Commercial, Industrial)

DC CHARACTERISTICS

Param Sym

No.

Characteristic

Standard Operating Conditions (unless otherwise stated)

Operating temperature

0°C ≤ TA ≤ +70°C for commercial

-40°C ≤ TA ≤ +85°C for industrial

Min Typ† Max Units

Conditions

D001

D002*

D003

D004*

D004A*

D005

D010

D010A

D020

D021

D021A

D022*

D022A*

1A

*

†

Note1:

2:

3:

4:

5:

6:

7:

VDD Supply Voltage

2.5

-

5.5

V

VBOR*

-

5.5

V BOR enabled (Note 7)

VDR RAM Data Retention Voltage(1)

-

1.5

-

V

VPOR VDD Start Voltage to ensure inter-

-

nal Power-on Reset signal

VSS

-

V See section on Power-on Reset for details

SVDD VDD Rise Rate to ensure internal 0.05

-

Power-on Reset signal

TBD

-

- V/ms PWRT enabled (PWRTE bit clear)

-

PWRT disabled (PWRTE bit set)

See section on Power-on Reset for details

VBOR Brown-out Reset

voltage trip point

3.65

- 4.35 V BODEN bit set

IDD

Supply Current(2,5)

-

2.0 3.8 mA XT, RC osc modes

FOSC = 4 MHz, VDD = 3.0V (Note 4)

-

22.5 48 µA LP osc mode

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

IPD

Power-down Current(3,5)

-

7.5 30 µA VDD = 3.0V, WDT enabled, -40°C to +85°C

-

0.9

5

µA VDD = 3.0V, WDT disabled, 0°C to +70°C

-

0.9

5

µA VDD = 3.0V, WDT disabled, -40°C to +85°C

∆IWDT

∆IBOR

Module Differential Current(6)

Watchdog Timer

Brown-out Reset

-

6.0 20 µA WDTE bit set, VDD = 4.0V

-

TBD 200 µA BODEN bit set, VDD = 5.0V

FOSC LP Oscillator Operating Frequency 0

RC Oscillator Operating Frequency 0

XT Oscillator Operating Frequency 0

HS Oscillator Operating Frequency 0

— 200 KHz All temperatures

—

4 MHz All temperatures

—

4 MHz All temperatures

—

20 MHz All temperatures

These parameters are characterized but not tested.

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-

sumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the

part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

For RC osc mode, current through Rext is not included. The current through the resistor can be estimated by the formula Ir

= VDD/2Rext (mA) with Rext in kOhm.

Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from characterization and is

for design guidance only. This is not tested.

The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base

IDD or IPD measurement.

This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will operate correctly to

this trip point.

DS41106A-page 78

Preliminary

© 1999 Microchip Technology Inc.

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