PIC16LC717T-I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC717T-I/SO Datasheet PDF : 200 Pages
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PIC16C717/770/771
17.4 18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
p
E1
D
2
B
n
1
h
α
45°
c
A
A2
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
Pitch
p
18
.050
18
1.27
Overall Height
A
.093
.099
.104
2.36
2.50
2.64
Molded Package Thickness
A2
.088
.091
.094
2.24
2.31
2.39
Standoff
A1
.004
.008
.012
0.10
0.20
0.30
Overall Width
E
.394
.407
.420
10.01
10.34
10.67
Molded Package Width
E1
.291
.295
.299
7.39
7.49
7.59
Overall Length
D
.446
.454
.462
11.33
11.53
11.73
Chamfer Distance
h
.010
.020
.029
0.25
0.50
0.74
Foot Length
L
.016
.033
.050
0.41
0.84
1.27
Foot Angle
φ
0
4
8
0
4
8
Lead Thickness
c
.009
.011
.012
0.23
0.27
0.30
Lead Width
B
.014
.017
.020
0.36
0.42
0.51
Mold Draft Angle Top
α
0
12
15
0
12
15
Mold Draft Angle Bottom
β
0
12
15
0
12
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
© 1999 Microchip Technology Inc.
Advanced Information
DS41120A-page 183
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