PIC16LC717T-I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC717T-I/SO Datasheet PDF : 200 Pages
| |||
PIC16C717/770/771
17.8 20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E
E1
p
D
B
2
n
1
α
c
A
A2
φ
L
A1
β
Units
INCHES*
MILLIMETERS
Number of Pins
Pitch
Dimension Limits MIN
n
p
NOM
20
.026
MAX
MIN
NOM
MAX
20
0.66
Overall Height
A
.068
.073
.078
1.73
1.85
1.98
Molded Package Thickness
A2
.064
.068
.072
1.63
1.73
1.83
Standoff
A1
.002
.006
.010
0.05
0.15
0.25
Overall Width
E
.299
.309
.322
7.59
7.85
8.18
Molded Package Width
E1
.201
.207
.212
5.11
5.25
5.38
Overall Length
D
.278
.284
.289
7.06
7.20
7.34
Foot Length
Lead Thickness
Foot Angle
L
.022
.030
.037
0.56
0.75
0.94
c
.004
.007
.010
0.10
0.18
0.25
φ
0
4
8
0.00
101.60
203.20
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.010
.013
.015
0.25
0.32
0.38
α
0
5
10
0
5
10
β
0
5
10
0
5
10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
© 1999 Microchip Technology Inc.
Advanced Information
DS41120A-page 187
Share Link: 