ST72260G1B6/XXX View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72260G1B6/XXX

8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES

STMicroelectronics 

ST72260G, ST72262G, ST72264G

Figure 111. Low Profile Fine Pitch Ball Grid Array Package

mm

inches

Dim

Min Typ Max Min Typ Max

A 1.210

1.700 0.048

0.067

A1 0.270

0.011

A2

1.120

0.044

b 0.450 0.500 0.550 0.018 0.020 0.022

D 5.750 6.000 6.150 0.226 0.236 0.242

D1

4.000

0.157

E 5.750 6.000 6.150 0.226 0.236 0.242

E1

4.000

0.157

e 0.720 0.800 0.880 0.028 0.031 0.035

f 0.850 1.000 1.150 0.033 0.039 0.045

ddd

0.120

0.005

14.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

SDIP32

SO28

LFBGA 6x6 (on multilayer PCB)

LFBGA 6x6 (on single-layer PCB)

Power dissipation 1)

Maximum junction temperature 2)

Value

60

75

56

72

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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