STM32F050G4U7 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F050G4U7

Low- and medium-density advanced ARM™-based 32-bit MCU with up to 32 Kbytes Flash, timers, ADC and comm. interfaces

STMicroelectronics 

Electrical characteristics

STM32F050xx

2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-

robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion

being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to

standard analog pins which may potentially inject negative current.

Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 6.3.13 does not

affect the ADC accuracy.

3. Better performance may be achieved in restricted VDDA, frequency and temperature ranges.

4. Data based on characterization results, not tested in production.

Figure 24. ADC accuracy characteristics

4095

4094

4093

7

6

5

4

3

2

1

1

LSBIDEAL



VDDA



(2)

ET

(3)

EO

EL

ED

1 LSBIDEAL

EG

(1)

(1) Example of an actual transfer curve

(2) The ideal transfer curve

(3) End point correlation line

ET=Total Unadjusted Error: maximum deviation

between the actual and the ideal transfer curves.

EO=Offset Error: deviation between the first actual

transition and the first ideal one.

EG=Gain Error: deviation between the last ideal

transition and the last actual one.

ED=Differential Linearity Error: maximum deviation

between actual steps and the ideal one.

EL=Integral Linearity Error: maximum deviation

between any actual transition and the end point

correlation line.

0

1 2345 67

VSSA

4093 4094 4095 4096

VDDA

-36

Figure 25. Typical connection diagram using the ADC

RAIN(1)

AINx

VAIN

Cparasitic

6$$!

VT

0.6 V

VT

0.6 V

IL±1 μA

Sample and hold ADC

converter

RADC

12-bit

converter

CADC

-36

1. Refer to Table 49: ADC characteristics for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy

this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 10. The 10 nF capacitor

should be ceramic (good quality) and it should be placed as close as possible to the chip.

74/97

Doc ID 023683 Rev 1

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