STPS30L40CW View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS30L40CW Datasheet PDF : 6 Pages
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STPS30L40CG/CT/CW
Fig. 9: Forward voltage drop versus forward
current (maximum values) (per diode).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm)
(STPS30L40CG only).
IFM(A)
200
100
Typical values
Tj=150°C
10
Tj=125°C
Tj=25°C
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 5 10 15 20 25 30 35 40
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
REF.
A
C
L7
D
M
E
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min. Max.
4.40 4.60
1.23 1.32
2.40 2.72
0.49 0.70
0.61 0.88
1.14 1.70
1.14 1.70
4.95 5.15
2.40 2.70
10 10.40
16.4 typ.
13
14
2.65 2.95
15.25 15.75
6.20 6.60
3.50 3.93
2.6 typ.
3.75 3.85
Min. Max.
0.173 0.181
0.048 0.051
0.094 0.107
0.019 0.027
0.024 0.034
0.044 0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
0.511 0.551
0.104 0.116
0.600 0.620
0.244 0.259
0.137 0.154
0.102 typ.
0.147 0.151
n COOLING METHOD : C
n RECOMMENDED TORQUE VALUE : 0.55 M.N
n MAXIMUM TORQUE VALUE : 0.70 M.N
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