STPS30L45CR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS30L45CR Datasheet PDF : 12 Pages
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STPS30L45C
Characteristics
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values,
per diode)
ambient versus copper surface
under tab for D2PAK
IFM(A)
200
100
Typical values
Tj=150°C
10
Tj=125°C
Tj=25°C
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0 5 10
Epoxy printed circuit board FP4,
copper thickness = 35 µm
S(cm²)
15 20 25 30 35 40
Doc ID 8002 Rev 4
5/12
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