TC1307R-3.0VQRTR View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
TC1307R-3.0VQRTR
Microchip Technology
TC1307R-3.0VQRTR Datasheet PDF : 28 Pages
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TC1307
Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA,
SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
FIGURE 2-19: Line Step Response.
70
60
50
40
30
20
10
0
1.0E+01
VIN = 4.1V
VOUT = 2.8V
COUT = 10µF Ceramic
ILOAD = 100 mA
1.0E+02 1.0E+03 1.0E+04 1.0E+05
Ripple Voltage Frequency (Hz)
1.0E+06
FIGURE 2-22: Power Supply Rejection Ratio vs.
Ripple Voltage Frequency.
FIGURE 2-20: Line Step Response.
70
60
50
40
30
20
10
0
1.0E+01
VIN = 4.1V
VOUT = 2.8V
COUT = 1 µF Ceramic
ILOAD = 100 mA
1.0E+02 1.0E+03 1.0E+04 1.0E+05
Ripple Voltage Frequency (Hz)
1.0E+06
FIGURE 2-21: Power Supply Rejection Ratio vs.
Ripple Voltage Frequency.
FIGURE 2-23: Output Noise.
FIGURE 2-24: Output Noise.
DS21702A-page 8
2002 Microchip Technology Inc.
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