TC1307
Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA,
SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN,TA = 25°C.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
FIGURE 2-25: Response From SHDN.
375
VDET = 0V to 2.7V
350
325
300
275
250
225
200
-40 -25 -10
5 20 35 50 65 80
Junction Temperature (°C)
95 110 125
FIGURE 2-28: Power-Up Reset Time-out Period vs.
Junction Temperature.
3
2.5 COUT = 1 µF
VOUT = Set to 2.8V
2
1.5
1
0.5
0
50
100
150
200
250
300
350
400
Output Current (mA)
FIGURE 2-26: Output Voltage vs. Current.
2.634
2.633
RESET = OPEN
2.632
2.631
2.63
2.629
2.628
2.627
2.626
-40 -25 -10 5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
FIGURE 2-29: Reset Threshold Voltage vs. Junction
Temperature.
500
450
COUT = 1 µF
ROUT < 0.1 ohm
400 VOUT = Set to 2.8V
350
300
250
200
150
100
50
0
1
2
3
4
5
6
Input Voltage (V)
FIGURE 2-27: Short Circuit Current vs. Input Voltage.
160
140
120
100
80
60
40
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
Overdrive Voltage (V below VTH)
FIGURE 2-30: Reset Delay vs. Overdrive Voltage.
2002 Microchip Technology Inc.
DS21702A-page 9