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TDA1566TH View Datasheet(PDF) - NXP Semiconductors.

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TDA1566TH Datasheet PDF : 46 Pages
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NXP Semiconductors
TDA1566
I2C-bus controlled dual channel/single channel amplifier
Note that in the J version no CLIP pin is available.
Table 14. Available diagnostic data J version
Diagnostic
I2C-bus mode
DIAG
POR
yes
Low VP or load dump detection yes
Clip detection
selectable
Temperature pre-warning
selectable
Short
selectable
Speaker protection
selectable
Offset detection
selectable
Maximum temperature
yes
protection
Load detection
no
Non-I2C-bus mode
DIAG
no
yes
yes
yes
yes
yes
no
yes
no
Following diagnostic information is only available via I2C-bus:
• DC and AC load detection results, see Section 6.2
• DB3[D4] is set when the DC settling of the amplifier has almost completed and the
SVR voltage has risen to a value of VP / 2 or above, see Section 6.5.1
6.3.2 Diagnostic level settings
Table 15. Clip and temperature pre-warning level setting
Setting
I2C-bus mode
Clip detection level
IB2[D7] = 0 selects 3 %
IB2[D7] = 1 selects 7 %
Temperature pre-warning level IB3[D4] = 0 selects 145 °C
IB3[D4] = 1 selects 122 °C
Non-I2C-bus mode
3%
145 °C
6.3.3 Temperature pre-warning
If in I2C-bus mode the average junction temperature reaches a by I2C-bus selectable level,
the pre-warning will be activated resulting in a LOW CLIP pin.
In non-I2C mode the thermal pre-warning is set on 145 °C.
In the TH version the thermal pre-warning is available on the CLIP pin in I2C-bus mode
and non-I2C mode.
In the J version the thermal pre-warning is available on the DIAG pin in non-I2C-bus mode.
In I2C-bus mode the presence of the thermal pre-warning on the DIAG is selected with
IB1[D4], see Section 6.3.1 and Section 6.4.2.
If the temperature increases above the pre-warning level, the temperature controlled gain
reduction will be activated for both channels resulting in a lower output power. If this does
not reduce the average junction temperature, both channels will be switched off at the
absolute maximum temperature Toff, typical 175 °C.
TDA1566_2
Product data sheet
Rev. 02 — 20 August 2007
Ā© NXP B.V. 2007. All rights reserved.
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