MCP6S22T-I/SL(2012) View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP6S22T-I/SL Datasheet PDF : 42 Pages
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MCP6S21/2/6/8
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
n
B
c
D
2
1
A
A1
L
A2
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Molded Package Length
D
Foot Length
L
Foot Angle
Lead Thickness
c
Lead Width
B1
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
INCHES
MIN
NOM
14
.026
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
MIN
NOM
14
0.65
0.85
0.05
6.25
4.30
4.90
0.50
0
0.09
0.19
0
0
0.90
0.10
6.38
4.40
5.00
0.60
4
0.15
0.25
5
5
MAX
1.10
0.95
0.15
6.50
4.50
5.10
0.70
8
0.20
0.30
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21117B-page 36
2003-2012 Microchip Technology Inc.
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