MCP6S22T-I/SL(2012) View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP6S22T-I/SL Datasheet PDF : 42 Pages
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MCP6S21/2/6/8
16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
B
n
45
c
2
1
h
A
A2
L
A1
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer Distance
h
Foot Length
L
Foot Angle
Lead Thickness
c
Lead Width
B
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
MIN
.053
.052
.004
.228
.150
.386
.010
.016
0
.008
.013
0
0
INCHES*
NOM
16
.050
.061
.057
.007
.237
.154
.390
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.394
.020
.050
8
.010
.020
15
15
MILLIMETERS
MIN
NOM
16
1.27
1.35
1.55
1.32
1.44
0.10
0.18
5.79
6.02
3.81
3.90
9.80
9.91
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.33
0.42
0
12
0
12
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
MAX
1.75
1.55
0.25
6.20
3.99
10.01
0.51
1.27
8
0.25
0.51
15
15
DS21117B-page 38
2003-2012 Microchip Technology Inc.
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