MCP6S22T-I/SL(2012) View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP6S22T-I/SL Datasheet PDF : 42 Pages
| |||
MCP6S21/2/6/8
16-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
E
A
A2
c
L
eB
A1
B1
B
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
Pitch
p
16
.100
16
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
Molded Package Width
E1
.240
.250
.260
6.10
6.35
Overall Length
D
.740
.750
.760
18.80
19.05
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
Lead Thickness
c
.008
.012
.015
0.20
0.29
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
Lower Lead Width
B
.014
.018
.022
.036
0.46
Overall Row Spacing
Mold Draft Angle Top
§
eB
.310
5
.370
10
.430
15
7.87
5
9.40
10
Mold Draft Angle Bottom
5
10
15
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-017
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
2003-2012 Microchip Technology Inc.
DS21117B-page 37
Share Link: 