ST7PLITE39F2U6TR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ST7PLITE39F2U6TR
STMicroelectronics
ST7PLITE39F2U6TR Datasheet PDF : 173 Pages
| |||
ST7LITE3xF2
Figure 107. 20-Pin Plastic Dual In-Line Package, 300-mil Width
b
D1
20
1
A2
A
A1
L
mm
inches1)
Dim.
Min Typ Max Min Typ Max
A
5.33
0.2098
c
A1 0.38
0.0150
b2
e
A2 2.92 3.30 4.95 0.1150 0.1299 0.1949
eB
b 0.36 0.46 0.56 0.0142 0.0181 0.0220
b2 1.14 1.52 1.78 0.0449 0.0598 0.0701
c 0.20 0.25 0.36 0.0079 0.0098 0.0142
D
D 24.89 26.16 26.92 0.9799 1.0299 1.0598
D1 0.13
0.0051
11
E1
10
e
2.54
0.1000
eB
10.92
0.4299
E1 6.10 6.35 7.11 0.2402 0.2500 0.2799
L 2.92 3.30 3.81 0.1150 0.1299 0.1500
Number of Pins
N
20
Note 1. Values in inches are converted from mm and
rounded to 4 decimal digits.
14.2 THERMAL CHARACTERISTICS
Symbol
Ratings
RthJA
TJmax
Package thermal resistance
(junction to ambient)
Maximum junction temperature 1)
PDmax
Maximum power dissipation 2)
DIP20
SO20
DIP20
SO20
Value
63
76
150
400
330
Unit
°C/W
°C
mW
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipa-
tion of an application is defined by the user with the formula: PD = PINT + PPORT where PINT is the chip
internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the
application.
160/173
Share Link: 