PIC32MX150F256HT-I/PT View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC32MX150F256HT-I/PT

32-bit Microcontrollers (up to 512 KB Flash and 64 KB SRAM) with Audio/Graphics/Touch (HMI), CAN, USB, and Advanced Analog

Microchip Technology 

PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY

TABLE 31-12: DC CHARACTERISTICS: PROGRAM MEMORY

DC CHARACTERISTICS

Standard Operating Conditions: 2.3V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial 

-40°C  TA  +105°C for V-temp

Param.

No.

Symbol

Characteristics

Min. Typical(1) Max.

Units

Conditions

Program Flash Memory(3)

D130 EP

Cell Endurance

20,000 —

—

E/W

—

D131 VPR

VDD for Read

2.3

—

3.6

V

—

D132 VPEW VDD for Erase or Write

2.3

—

3.6

V

—

D134 TRETD Characteristic Retention

20

—

—

Year Provided no other

specifications are

violated

D135 IDDP Supply Current during

—

10

—

mA

—

Programming

TWW Word Write Cycle Time

—

411

— FRC Cycles See Note 4

D136 TRW Row Write Cycle Time

—

6675

— FRC Cycles See Note 2,4

D137 TPE

Page Erase Cycle Time

—

20011

— FRC Cycles See Note 4

TCE

Chip Erase Cycle Time

—

80180

— FRC Cycles See Note 4

Note 1:

2:

Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.

The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities

during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus

loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The

default Arbitration mode is mode 1 (CPU has lowest priority).

3: Refer to the “PIC32 Flash Programming Specification” (DS60001145) for operating conditions during

programming and erase cycles.

4: This parameter depends on FRC accuracy (See Table 31-19) and FRC tuning values (See Register 8-2).

DS60001290E-page 318

 2014-2017 Microchip Technology Inc.

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