ST72324Lxx
12.8 I/O PORT PIN CHARACTERISTICS
12.8.1 General Characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
VIL
VIH
Vhys
IINJ(PIN)3)
Input low level voltage 1)
Input high level voltage 1)
Schmitt trigger voltage hysteresis 2)
Injected Current on flash device pin
PB0
Injected Current on other I/O pins
0.7xVDD
0.8
0
ΣIINJ(PIN)3)
Total injected current (sum of all I/O
and control pins)
VDD=3V
Ilkg Input leakage current
VSS ≤ VIN ≤ VDD
IS
Static current consumption
Floating input mode4)
RPU Weak pull-up equivalent resistor 5) VIN=VSS
VDD=3V
110
180
CIO I/O pin capacitance
5
tf(IO)out Output high to low level fall time 1) CL=50pF
25
tr(IO)out Output low to high level rise time 1) Between 10% and 90%
25
tw(IT)in External interrupt pulse time 6)
1
Max
0.3xVDD
Unit
V
V
+4
±4
± 25
±1
200
250
mA
mA
µA
kΩ
pF
ns
tCPU
Notes:
1. Data based on characterization results, not tested in production.
2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
3. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be
respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD
while a negative injection is induced by VIN<VSS. For true open-drain pads, there is no positive injection current, and the
corresponding VIN maximum must always be respected
4. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for
example or an external pull-up or pull-down resistor (see Figure 65). Static peak current value taken at a fixed VIN value,
based on design simulation and technology characteristics, not tested in production. This value depends on VDD and tem-
perature values.
5. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics de-
scribed in Figure 66).
6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
Figure 65. Connecting Unused I/O Pins
VDD
10kΩ
ST72XXX
UNUSED I/O PORT
10kΩ
UNUSED I/O PORT
ST72XXX
Note: I/O can be left unconnected if it is configured as output
(0 or 1) by the software. This has the advantage of
greater EMC robustness and lower cost.
Figure 66. Typical IPU vs. VDD with VIN=VSS
90
80
Ta= 1 40°C
Ta= 9 5°C
70
Ta= 2 5°C
60
Ta=-45 °C
50
40
30
20
10
0
2 2 .5 3 3 .5 4 4 .5 5 5 .5 6
V dd (V )
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1