ST72324BLJ2B5 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72324BLJ2B5

3V range 8-bit MCU with 8 to 32K Flash/ROM, 10-bit ADC, 4 timers, SPI, SCI interface

STMicroelectronics 

ST72324Lxx

PACKAGE MECHANICAL DATA (Cont’d)

Figure 86. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width

b2

D

A2 A

A1

L

C

b

e

mm

inches

Dim.

Min Typ Max Min Typ Max

E

eC

A 3.56 3.76 5.08 0.140 0.148 0.200

A1 0.51

0.020

A2 3.05 3.56 4.57 0.120 0.140 0.180

b 0.36 0.46 0.58 0.014 0.018 0.023

E1

b1 0.76 1.02 1.40 0.030 0.040 0.055

eA

eB

C 0.20 0.25 0.36 0.008 0.010 0.014

D 27.43

28.45 1.080 1.100 1.120

E 9.91 10.41 11.05 0.390 0.410 0.435

E1 7.62 8.89 9.40 0.300 0.350 0.370

e

1.78

0.070

eA

10.16

0.400

eB

12.70

0.500

eC

1.40

0.055

L 2.54 3.05 3.81 0.100 0.120 0.150

Number of Pins

N

32

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

LQFP48 7x7

LQFP44 10x10

LQFP32 7x7

SDIP32 200mil

Power dissipation 1)

Maximum junction temperature 2)

Value

80

52

70

50

500

150

Unit

°C/W

mW

°C

Notes:

1. The maximum chip-junction temperature is based on technology characteristics.

2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is

the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the applica-

tion.

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