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ST72324BLJ2B5 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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ST72324BLJ2B5 Datasheet PDF : 154 Pages
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ST72324Lxx
13.3 SOLDERING INFORMATION
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a Lead-free second level in-
terconnect. The category of second Level Inter-
connect is marked on the package and on the in-
ner box label, in compliance with JEDEC Standard
JESD97.
The maximum ratings related to soldering condi-
tions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
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