NXP Semiconductors
PCA8550
4-bit multiplexed/1-bit latched 5-bit I2C EEPROM DIP switch
14. Soldering: PCB footprints
Footprint information for reflow soldering of SO16 package
SOT109-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4×)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
1.270 1.320 7.400 3.900 1.750 0.700 0.800 10.040 5.200 11.900 7.650
Fig 13. PCB footprint for SOT109-1 (SO16); reflow soldering
PCA8550
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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