NXP Semiconductors
PCA8550
4-bit multiplexed/1-bit latched 5-bit I2C EEPROM DIP switch
Footprint information for reflow soldering of SSOP16 package
SOT338-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.65 0.75 8.6 5.4 1.6 0.4 0.6 5.6 6.1 7.0 8.85
Issue date
09-02-22
15-03-26
Fig 14. PCB footprint for SOT338-1 (TSSOP16); reflow soldering
PCA8550
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 April 2015
sot338-1_fr
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 23