NXP Semiconductors
PCA8550
4-bit multiplexed/1-bit latched 5-bit I2C EEPROM DIP switch
Footprint information for reflow soldering of TSSOP16 package
SOT403-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 5.600 5.300 5.800 7.450
Fig 15. PCB footprint for SOT403-1 (TSSOP16); reflow soldering
PCA8550
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 April 2015
sot403-1_fr
© NXP Semiconductors N.V. 2015. All rights reserved.
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