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ST7FDALI View Datasheet(PDF) - STMicroelectronics

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Description
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ST7FDALI Datasheet PDF : 141 Pages
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ST7DALI
PACKAGE CHARACTERISTICS (Cont’d)
Table 22. THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance
(junction to ambient)
Power dissipation 1)
Maximum junction temperature 2)
SO20
DIP20
Value
125
TBD
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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