ST7FDALI View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ST7FDALI
STMicroelectronics
ST7FDALI Datasheet PDF : 141 Pages
| |||
ST7DALI
14.2 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only as design guidelines.
Figure 95. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
200
150
Temp. [°C]
100
50
80°C
PREHEATING
PHASE
5 sec
SOLDERING
PHASE
COOLING PHASE
(ROOM TEMPERATURE)
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 96. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=220+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
100
200
300
Time [sec]
400
Recommended glue for SMD plastic packages:
■ Heraeus: PD945, PD955
■ Loctite: 3615, 3298
129/141
Share Link: 