BAP64-06 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
BAP64-06 Datasheet PDF : 9 Pages
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NXP Semiconductors
8 Package outline
Plastic surface-mounted package; 3 leads
D
B
BAP64-06
Silicon PIN diode
SOT23
E
A
X
3
1
e1
bp
e
2
wB
HE
vA
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
A A1 bp c D E e e1 HE Lp Q v w
max 1.1 0.1 0.48 0.15 3.0 1.4
2.5 0.45 0.55
mm nom
1.9 0.95
0.2 0.1
min 0.9
0.38 0.09 2.8 1.2
2.1 0.15 0.45
Outline
version
References
IEC
JEDEC
JEITA
SOT23
TO-236AB
Figure 5. Package outline SOT23
BAP64-06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 22 March 2019
European
projection
sot023_po
Issue date
14-06-19
14-09-22
© NXP B.V. 2019. All rights reserved.
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