PIC16(L)F1512/3
25.4 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient
80
C/W 28-pin SOIC package
60
C/W 28-pin SPDIP package
90
C/W 28-pin SSOP package
27.5
C/W 28-pin UQFN package
TH02
JC Thermal Resistance Junction to Case
24
C/W 28-pin SOIC package
31.4
C/W 28-pin SPDIP package
24
C/W 28-pin SSOP package
24
C/W 28-pin UQFN package
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
—
W
PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
—
W
PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
—
W
PDER = PDMAX (TJ - TA)/JA(2)
Legend: TBD = To Be Determined
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
DS40001624C-page 294
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