M24M01-RMN6P 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

M24M01-RMN6P

1-Mbit serial I²C bus EEPROM

STMicroelectronics 

Package information

9

Package information

M24M01-R M24M01-DF

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

For die information concerning the M24M01 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

9.1

TSSOP8 package information

Figure 15.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline



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1. Drawing is not to scale.

76623$0B9

Table 16. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data

Symbol

Min.

millimeters

Typ.

Max.

Min.

inches(1)

Typ.

Max.

A

-

-

1.200

-

-

0.0472

A1

0.050

-

0.150

0.0020

-

0.0059

A2

0.800

1.000

1.050

0.0315

0.0394

0.0413

b

0.190

-

0.300

0.0075

-

0.0118

c

0.090

-

0.200

0.0035

-

0.0079

CP

-

-

0.100

-

-

0.0039

D

2.900

3.000

3.100

0.1142

0.1181

0.1220

e

-

0.650

-

-

0.0256

-

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DocID12943 Rev 14

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