M24M01-RMN6P 查看數據表（PDF） - STMicroelectronics
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M24M01-RMN6P Datasheet PDF : 47 Pages
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Package information
M24M01-R M24M01-DF
Figure 21. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
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1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.525
0.565
0.605
0.0207
0.0222
0.0238
A1
-
0.190
-
-
0.0075
-
A2
-
0.350
-
-
0.0138
-
A3
-
0.025
-
b(2)
-
0.270
-
-
0.0010
-
-
0.0106
-
D
-
2.578
2.598
-
0.1015
0.1023
E
-
1.716
1.736
-
0.0676
0.0683
e
-
1.000
-
-
0.0394
-
e1
-
0.866
-
-
0.0341
-
e2
-
0.500
-
-
0.0197
-
DocID12943 Rev 14
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