M24M01-RMN6P 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

M24M01-RMN6P

1-Mbit serial I²C bus EEPROM

STMicroelectronics 

Package information

M24M01-R M24M01-DF

9.4

WLCSP8 package information

Figure 20. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline

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1. Drawing is not to scale.

2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

Table 19. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.500

0.540

0.580

0.0197

0.0213

0.0228

A1

-

0.190

-

-

0.0075

-

A2

-

0.350

-

b(2)

-

0.270

-

-

0.0138

-

-

0.0106

-

D

-

2.578

2.598

-

0.1015

0.1023

E

-

1.716

1.736

-

0.0676

0.0683

e

-

1.000

-

-

0.0394

-

e1

-

0.866

-

-

0.0341

-

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