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ISPGDX160V-3Q208I View Datasheet(PDF) - Lattice Semiconductor

Part Name
Description
Manufacturer
ISPGDX160V-3Q208I
Lattice
Lattice Semiconductor 
ISPGDX160V-3Q208I Datasheet PDF : 36 Pages
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ispGDX ®160V/VA
In-System Programmable
3.3V Generic Digital Crosspoint
Features
Functional Block Diagram
• IN-SYSTEM PROGRAMMABLE GENERIC DIGITAL
CROSSPOINT FAMILY
— Advanced Architecture Addresses Programmable
PCB Interconnect, Bus Interface Integration and
S Jumper/Switch Replacement
— “Any Input to Any Output” Routing
— Fixed HIGH or LOW Output Option for Jumper/DIP
Switch Emulation
E — Space-Saving PQFP and BGA Packaging
— Dedicated IEEE 1149.1-Compliant Boundary Scan
Test
IC • HIGH PERFORMANCE E2CMOS® TECHNOLOGY
D — 3.3V Core Power Supply
— 3.5ns Input-to-Output/3.5ns Clock-to-Output Delay*
— 250MHz Maximum Clock Frequency*
V E — TTL/3.3V/2.5V Compatible Input Thresholds and
Output Levels (Individually Programmable)*
— Low-Power: 16.5mA Quiescent Icc*
E — 24mA IOL Drive with Programmable Slew Rate
U Control Option
— PCI Compatible Drive Capability*
— Schmitt Trigger Inputs for Noise Immunity
D IN — Electrically Erasable and Reprogrammable
— Non-Volatile E2CMOS Technology
• ispGDXV OFFERS THE FOLLOWING ADVANTAGES
T — 3.3V In-System Programmable Using Boundary Scan
T Test Access Port (TAP)
— Change Interconnects in Seconds
C • FLEXIBLE ARCHITECTURE
N — Combinatorial/Latched/Registered Inputs or Outputs
— Individual I/O Tri-state Control with Polarity Control
E — Dedicated Clock/Clock Enable Input Pins (four) or
O Programmable Clocks/Clock Enables from I/O Pins
(40)
L — Single Level 4:1 Dynamic Path Selection (Tpd = 3.5ns)
— Programmable Wide-MUX Cascade Feature
E C Supports up to 16:1 MUX
— Programmable Pull-ups, Bus Hold Latch and Open
Drain on I/O Pins
S IS — Outputs Tri-state During Power-up (“Live Insertion”
Friendly)
D • LEAD-FREE PACKAGE OPTIONS
I/O Pins D
ISP
Control
I/O
Cells
Global Routing
Pool
(GRP)
I/O
Cells
Boundary
Scan
Control
I/O Pins B
Description
The ispGDXV/VA architecture provides a family of fast,
flexible programmable devices to address a variety of
system-level digital signal routing and interface require-
ments including:
• Multi-Port Multiprocessor Interfaces
• Wide Data and Address Bus Multiplexing
(e.g. 16:1 High-Speed Bus MUX)
• Programmable Control Signal Routing
(e.g. Interrupts, DMAREQs, etc.)
• Board-Level PCB Signal Routing for Prototyping or
Programmable Bus Interfaces
The devices feature fast operation, with input-to-output
signal delays (Tpd) of 3.5ns and clock-to-output delays of
3.5ns.
The architecture of the devices consists of a series of
* “VA” Version Only
programmable I/O cells interconnected by a Global Rout-
ing Pool (GRP). All I/O pin inputs enter the GRP directly
or are registered or latched so they can be routed to the
required I/O outputs. I/O pin inputs are defined as four
sets (A,B,C,D) which have access to the four MUX inputs
Copyright © 2004 Lattice Semiconductor Corporation. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein
are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
August 2004
gdx160va_06
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