M69KB096AB View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

M69KB096AB

64 Mbit (4Mb x 16)/ 104MHz Clock Rate 1.8V Supply - Bare Die Burst PSRAM

STMicroelectronics 

10 Wafer and die specifications

10 Wafer and die specifications

M69KB096AB

Table 24. Dimensions

Wafer Diameter

200mm (8")

Wafer Thickness

750± 25µm (29.5±1.0mil)

Die Size (stepping interval)

5,009.365µm x 5,005.795µm

Street Width Along X-Axis (dsw_X) 102µm

Street Width Along Y-Axis (dsw_Y) 102µm

Center of Street (COS) (relative to

Bond Pad 1)

X = -222.98µm, Y = 160.08µm (X = -8.779mil, Y = 6.303mil)

Bond Pad Size

85µm x 100µm (3.35mil x 3.94mil)

Passivation Openings (MIN)

75µm x 90µm (2.95mil x 3.54mil)

Minimum Bond Pad Pitch

119.00µm (4.685mil)

Pad Count

71

66/73

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