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M69KB096AB View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
M69KB096AB Datasheet PDF : 73 Pages
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10 Wafer and die specifications
69
VCCQ
-1,846.54
-2,317.02
70
DQ8
-1,965.54
-2,317.02
71
DQ0
-2,084.54
-2,317.02
1. Reference from the center of each bond pad to the center of the die (0,0).
2. DNU stands for ‘do not use’.
M69KB096AB
-0.0726984
-0.0773835
-0.0820685
-0.0912211
-0.0912211
-0.0912211
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