NXP Semiconductors
P89LPC9301/931A1
8-bit microcontroller with accelerated two-clock 80C51 core
12. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
y
Z
28
pin 1 index
1
e
E
A
X
c
HE
vM A
15
14
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT361-1
MO-153
L
Lp
Q
v
w
y
Z (1)
θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.8
0.5
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 38. TSSOP package outline (SOT361-1)
P89LPC9301_931A1_1
Preliminary data sheet
Rev. 01 — 9 April 2009
© NXP B.V. 2009. All rights reserved.
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