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PIC16C64A/JW View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC16C64A/JW
Microchip
Microchip Technology 
PIC16C64A/JW Datasheet PDF : 108 Pages
First Prev 91 92 93 94 95 96 97 98 99 100 Next Last
PIC16C62X
14.0 PACKAGING INFORMATION
Package Type: K04-010 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil
E
W2
D
2
n
1
W1
E1
A
R
c
eB
A2
B1
B
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D
Package Width
E
Radius to Radius Width
E1
Overall Row Spacing
eB
Window Width
W1
Window Length
W2
* Controlling Parameter.
MIN
0.098
0.016
0.050
0.010
0.008
0.175
0.091
0.015
0.125
0.880
0.285
0.255
0.345
0.130
0.190
INCHES*
NOM
0.300
18
0.100
0.019
0.055
0.013
0.010
0.183
0.111
0.023
0.138
0.900
0.298
0.270
0.385
0.140
0.200
MAX
0.102
0.021
0.060
0.015
0.012
0.190
0.131
0.030
0.150
0.920
0.310
0.285
0.425
0.150
0.210
A1
L
p
MILLIMETERS
MIN
NOM
7.62
18
2.49
2.54
0.41
0.47
1.27
1.40
0.25
0.32
0.20
0.25
4.45
4.64
2.31
2.82
0.00
0.57
3.18
3.49
22.35
22.86
7.24
7.56
6.48
6.86
8.76
9.78
0.13
0.14
0.19
0.2
MAX
2.59
0.53
1.52
0.38
0.30
4.83
3.33
0.76
3.81
23.37
7.87
7.24
10.80
0.15
0.21
© 1998 Microchip Technology Inc.
Preliminary
DS30235G-page 95

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