PIC16C64A/JW View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16C64A/JW Datasheet PDF : 108 Pages
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14.1 Package Marking Information
18-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCDE
18-Lead SOIC (.300")
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
XXXXXXXX
XXXXXXXX
AABBCDE
20-Lead SSOP
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
PIC16C62X
Example
PIC16C622A
-04I / P456
9823 CBA
Example
PIC16C622
-04I / S0218
9818 CDK
Example
16C622
/JW
9801 CBA
Example
PIC16C622A
-04I / 218
9851 CBP
Legend: MM...M
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
© 1998 Microchip Technology Inc.
Preliminary
DS30235G-page 99
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